基于X86+FPGA的多接口融合开发平台
开发平台由 PIB 底板和X86核心板构成，其中 PIB 底板是一块以 FPGA 为核心的可编程多外设接口板 (相当于一块电脑主板)；而X86核心板是一块集成了X86 i7 CPU和内存接口的核心板, 将两者组合即相当于一台完整的X86主机系统。
FPGA
- PCIe Gen2 x1 and PCIe Gen2 x4(5 Gbps), eSPI(low speed)
- Serial configuration device: EPCQ256
- External JTAG header
- 1GB DDR3 SDRAM(32-bit data bus)
- Gigabit Ethernet x4
- LVDS Camera x4, MIPI Camera x2
- RS232 x2, RS485 x1, CAN x2
- 20-pin GPIO Header
- 9-axis sensor(accelerometer, magnetometer, and gyroscope)
- FPGA_RST Button x1, KEY x2, green LED x2
- Four 50MHz clock sources from the clock generator
- FuSa
- tGPIO x2
CPU(Support Flex CM)
- HDMI x1
- Gigabit Ethernet x1
- USB 3.0 x3, USB 2.0 x1
- Audio Jack x1(Line-in, Line-out)
- SATA x1, mSATA x1
- M.2 Wi-Fi x1
- RS232 x2, RS485 x1(Shared with FPGA)
- 20-pin GPIO Header
- CM(Computer Module)
- i7-1165G7 CPU
- Total Cores: 4
- Total Threads: 8
- Base Frequency: 2.8GHz
- TDP: 15W
- BIOS: AMI UEFI BIOS at 128 Mbit SPI
- Memory: DDR4 SO-DIMM socket x2, support maximum capacity of 32GB
- Graphics: Intel HD Graphics
- Expansion CONN1: DP++, USB3.0/PCIe x2, PCIe x4, SATA/PCIe x1, USB 2.0, LPC/eSPI, Legacy IO, +12V DC Power
- Expansion CONN2: DP++, SATA/PCIe x1, USB3.0/PCIe x2, SGMII/PCIe x3, USB 2.0, HDA, Legacy IO, +12V DC Power
- Power: +12V DC Power from CONN1 and CONN2
- OS: Support Window and Linux
- Working temperature: -20~60℃
- Dimensions(L×H): 125 × 95mm
Block Diagram of PIB Platform
PIB Computer Module
- CPU: Intel 11th Core i7
- HDMI x1
- Ethernet x1 (I219)
- USB3.0 x3, USB2.0 x1
- Audio Jack x1(line in, line out )
- SATA x1, mSATAx1, M.2 for Wifi x1
- RS232 x2, RS485 x1 (shared with FPGA)
- GPIO 20 Pin Header x1 (16 PIN 3.3V General Purpose IO with ESD protect)