Newsroom About Terasic Products Turnkey Solutions Training FAQ
Cart
 
   
   





Bundle Solution Introduction

The Terasic bundle selection offers a host of system-ready solutions at a cost-effective price. By combining daughter cards with FPGA main boards to create customized configurations, users can easily and conveniently target end applications. Full open-source reference designs are also included with the kit, ensuring that all systems are ready to go at the touch of a button.

Bundle Solution

FPGA Cloud Connectivity Kit
  • Cyclone V SoC with Dual-core ARM Cortex-A9 (HPS)
  • Wi-Fi, using ESP-WROOM-02 module
  • Bluetooth SPP, using HC-05 module, up to 10 meter range
  • Arduino Expansion Header (Uno R3 Compatibility), Full HD HDMI Output, UART-to-USB, USB OTG Port, Micro SD Card Socket, Gigabit Ethernet and GPIO Headers

VEEK-MT2-C5SoC
  • Cyclone V SX SoC—5CSXFC6D6F31C6N (SoC)
  • 8-Megapixel Digital Image Sensor Module with auto focus
  • 7" LCD Touch Screen Module with 5 point touch
  • Accelerometer, Gyroscope, Magnetometer, Ambient Sensor

Cyclone V E Video Development System
  • Cyclone V E FPGA - 5CEFA7F31I7N
  • DDR3, LPDDR2, Flash, SSRAM, EEPROM
  • Ethernet, UART interface, HSMC, DVI I/O

Stratix V GX Video Development System
  • Stratix V GX FPGA 5SGXEA7K2F40C2N
  • DDR3 SDRAM, QDR II+ SRAM, RLDRAM II
  • PCIe x8, HSMC, SDI, QSFP, Gigabit Ethernet, DVI I/O

Industrial Networking Kit (INK)
  • Cyclone IV EP4CE115 with ~114,480 LEs
  • 2 Gigabit Ethernet Ports, HSMC connector
  • Supports CAN, RS-485, and RS-232 interfaces
Newsroom | About Terasic | Products | Turnkey Solutions | Training | FAQ | Contact Us | Subscribe | Facebook | YouTube